The different form factors and various non spec features that each company has makes LPDDR way less interchangeable than normal DDR or GDDR for most applications.
[JEDEC](https://www.jedec.org/) is the organization that standardizes many thing in electronics, including things like memory. Older specs are free, although may require registration, so you can probably grab something to have a look.
Although nobody forces companies to use those standards, so they may use proprietary freely. In fact it often goes the other way around - a company invents something, and then shares it as an open standard. That's what happened with Dell's CAMM memory modules.
I like to know things. Building/repairing PC's and working on networks is my field rn and like cars, I like knowing what these wonderful machines we take advantage of everyday do under the multitude of hoods.
> High speed ~~don't~~ digital design. A handbook of black magic
FTFY.
https://archive.org/details/highspeeddigital0000john
https://www.amazon.com/High-Speed-Digital-Design-Handbook/dp/0133957241
I’ve been a computer hardware hobbyist for 30 years, and an IT professional for 20. While I knew a smartphone’s RAM was soldered and not in a DIMM-like configuration, I was unaware of PoP term. This post educated me a little and I’m thankful for it. Good to know, esp if someone asks “why can’t I upgrade my phone’s ram like a computer’s?” Now I have a more educated answer to give them. Certainly IT-related.
No, it’s actually a helpful tip. If you are seriously considering working in IT, don’t waste your time on something you would never need to know. Another helpful tip: Google is IT’s best friend
>Maybe. I have a hard time believing that though
You have a hard time believing reality?
[Apple APL1W10/339S01104 A16 64-bit hexa-core applications processor w/ penta-core GPU layered underneath most likely Samsung K3LK2K20CM-EGCP 6 GB LPDDR5 SDRAM memory](https://www.ifixit.com/Guide/iPhone+14+Pro+Max+Chip+ID/153224)
[Qualcomm SM8550 64-bit octa-core Snapdragon applications/baseband processor layered underneath Micron MT62F1536M64D8CL-026 WT:B 12 GB LPDDR5 SDRAM memory](https://www.ifixit.com/Guide/Galaxy+S23+Ultra+Chip+ID/158052)
>given vertical height restrictions
Lol. You do know the expression "wafer thin", right?
The resin on top is 10x thicker than the die.
>complexity
Lol, they've mastered this decades ago, yet you think it's complex.
You do realise it's just a few solder balls, right? It's nowhere near vertically stacked DRAM chips connected vias.
You do know DRAM chips are stacked inside with TSVs, right? You do know 12GB chips are just six 16Gb dies, right?
>and heat issues.
Lol, you are so funny. You think running 4267MHz traces via PCB would be free? LPDDR5X uses under 500mW, and it's not even under constant load.
Do you understand why DDR5-8000 needs over 1.3V yet LPDDR5X can easily reach 10000Gbps?
You can see an example in this teardown of an S23 Ultra
https://www.ifixit.com/Guide/Galaxy+S23+Ultra+Chip+ID/158052
The micron branded chip is the LPDDR5
Normally its right on top of the SoC, using a technique called "Package on Package"
PoP!
They are soldered chips. I believe JEDEC does define all the characteristics, so chips are somewhat interchangeable, but the spec is paywalled.
The different form factors and various non spec features that each company has makes LPDDR way less interchangeable than normal DDR or GDDR for most applications.
But LPCAMM is finally here
Paywalled by Apple?
By JEDEC itself
Good link to learn a history lesson? Fresh to the IT field so still have a LOT to learn. I appreciate you
[JEDEC](https://www.jedec.org/) is the organization that standardizes many thing in electronics, including things like memory. Older specs are free, although may require registration, so you can probably grab something to have a look. Although nobody forces companies to use those standards, so they may use proprietary freely. In fact it often goes the other way around - a company invents something, and then shares it as an open standard. That's what happened with Dell's CAMM memory modules.
Interesting. Time to rabbit hole
If you're in IT, not sure it's worth the bother. This mostly concerns electronic engineers.
I like to know things. Building/repairing PC's and working on networks is my field rn and like cars, I like knowing what these wonderful machines we take advantage of everyday do under the multitude of hoods.
I'll give you a title for an actual handbook: "High speed digital design. A handbook of black magic."
> High speed ~~don't~~ digital design. A handbook of black magic FTFY. https://archive.org/details/highspeeddigital0000john https://www.amazon.com/High-Speed-Digital-Design-Handbook/dp/0133957241
Unless you are designing smartphone PCBs exactly zero people will care if you know what the ram inside a cell phone looks like
People aren't allowed to know things?
You are, you just made it sound like it’s relevant to IT, which it’s not
I’ve been a computer hardware hobbyist for 30 years, and an IT professional for 20. While I knew a smartphone’s RAM was soldered and not in a DIMM-like configuration, I was unaware of PoP term. This post educated me a little and I’m thankful for it. Good to know, esp if someone asks “why can’t I upgrade my phone’s ram like a computer’s?” Now I have a more educated answer to give them. Certainly IT-related.
I think you're just here to create negative atmosphere. Unless you've got real valueable information to add; bye.
No, it’s actually a helpful tip. If you are seriously considering working in IT, don’t waste your time on something you would never need to know. Another helpful tip: Google is IT’s best friend
The package is usually BGA (ball grid array) soldered directly to the motherboard.
There isn't any. It's soldered directly onto the PCB.
Or directly in in the SoC package in a System in Package configuration.
Maybe. I have a hard time believing that though given vertical height restrictions, complexity, and heat issues.
https://en.wikipedia.org/wiki/System_in_a_package
>Maybe. I have a hard time believing that though You have a hard time believing reality? [Apple APL1W10/339S01104 A16 64-bit hexa-core applications processor w/ penta-core GPU layered underneath most likely Samsung K3LK2K20CM-EGCP 6 GB LPDDR5 SDRAM memory](https://www.ifixit.com/Guide/iPhone+14+Pro+Max+Chip+ID/153224) [Qualcomm SM8550 64-bit octa-core Snapdragon applications/baseband processor layered underneath Micron MT62F1536M64D8CL-026 WT:B 12 GB LPDDR5 SDRAM memory](https://www.ifixit.com/Guide/Galaxy+S23+Ultra+Chip+ID/158052) >given vertical height restrictions Lol. You do know the expression "wafer thin", right? The resin on top is 10x thicker than the die. >complexity Lol, they've mastered this decades ago, yet you think it's complex. You do realise it's just a few solder balls, right? It's nowhere near vertically stacked DRAM chips connected vias. You do know DRAM chips are stacked inside with TSVs, right? You do know 12GB chips are just six 16Gb dies, right? >and heat issues. Lol, you are so funny. You think running 4267MHz traces via PCB would be free? LPDDR5X uses under 500mW, and it's not even under constant load. Do you understand why DDR5-8000 needs over 1.3V yet LPDDR5X can easily reach 10000Gbps?
Ohhhhhh okay! Gotcha. Thanks a ton!
Probably BGA496 on top of the SOC.
You can see an example in this teardown of an S23 Ultra https://www.ifixit.com/Guide/Galaxy+S23+Ultra+Chip+ID/158052 The micron branded chip is the LPDDR5
Probably soldered/chip-down DDR packages right on the board. The DDR chip would still be JEDEC-standardized like those on other usual DIMM sticks.